Tag Archives: assembly

Blog: Google Nexus S disassembly

Exactly one day after being released for sale, Nexus S arrived in the hands of experts from iFixit. Dissection to the smallest components revealed all the secrets of this long-awaited smartphone from Samsung, some of which are unexpected.

The first thing he noticed is that the Nexus S comes with variations of components and contains almost the same hardware as the Galaxy cell phone. Nexus S comes with 1 GHz ARM Cortex-A8 Hummingbird Processor, 16 GB internal memory, 512 MB RAM, 5 MP camera, front VGA camera (640×480) and Android 2.3 (Gingerbread) OS. So, the specs are exactly as they would expect from such a device.

However, the first surprise comes from what Google has described, “a slightly concave screen. From Google’s statement, expected to be complete Super AMOLED display slightly concave, which is not true. Only a small part of the upper concave screen.

A strange and unique design also appears with the motherboard. The motherboard has a big hole in it, which is located inside the battery. In other words, the motherboard is around the battery. This feature is uncharacteristic for mobile phones.

Similar to the Samsung Galaxy S, Nexus S comes with front and rear camera. Interestingly, both cameras share the same connector on the motherboard and can be removed as a component. A similar situation exists with the speaker and the slot receiver. Although this is a very good integration, users will fail some of these components have to change all that is connected to the same connector.

Other components on the motherboard are:
* Skyworks SKY77529 Tx Front-End Module for Dual-Band GSM / GPRS / EDGE
* SDIN4C2 SanDisk 16GB MLC NAND flash.
* Samsung A453 KB100D00WM-memory package and S5PC110A01 1GHz Hummingbird Cortex A8 processor.
* 8824 XG616 Infineon X-Gold baseband processor.